From May to August 2023, I interned at TDK Corporation in France, focusing on developing dynamic tests for MEMS gyroscopes and accelerometer sensors. During these four months, I worked on prototyping, automation, and performance characterization.
MEMS (Micro-Electro-Mechanical Systems) sensors are devices that combine electrical and mechanical components at a very small scale, typically at the micron level. These sensors can detect changes in the environment, such as motion, orientation, and pressure, by converting mechanical signals into electrical signals. MEMS sensors are widely used in various applications, including navigation systems, mobile devices, and industrial machinery, due to their small size, low power consumption, and high accuracy.
Dynamic testing is a big point for MEMS sensors because it assesses their performance under real-world conditions where they are subjected to various forces and motions. By conducting dynamic tests (with electrical stimulation), we can ensure that the sensors provide accurate and reliable data during their actual use.
My primary task was prototyping dynamic tests for sensor sockets using lock-in amplifiers. This involved working with synchronous detection amplifiers to ensure precision in our testing processes. The goal was to create a reliable method for testing the dynamic performance of MEMS sensors.
In addition to prototyping, I developed sequenced tests for wafer-testing in a cleanroom environment. This required automating the testing process on a prober, ensuring direct contact connections, and later connecting to a matrix bloc of tests.
A key part of my role was characterizing the Measurement System Analysis (MSA) performance. This involved testing and analysis to ensure the measurement systems were accurate and reliable. The MSA characterization helped fine-tune the testing processes to meet industry standards.
At the end of the internship, my efforts yielded significant results. I managed to reduce the measurement time by a factor of 30, greatly increasing efficiency and lowering the time usage of the probers.
The dynamic testing protocols I developed were not only reliable but also adaptable for future products, providing a scalable solution for ongoing and upcoming projects.
Additionally, the automated generation of WaferMap with a database added another layer of efficiency, streamlining operations further.
Full details and references can be found in the PDF below: